Ultrasonic Soldering Technolgy by MBR ELECTRONICS GmbH

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Active Solder Alloy CERASOLZER


- Flux free
- Corrosion free
- Soldering temperatures between 150°C - 290°C
- Wetting ability to glass and ceramics

Cerasolzer Active Alloy

Cerasolzer is used in manufacture of electrical parts, to contact electrical / electronically materials and flat glass / metalized glasses because it provides a unique bonding technique that can take the place of commonly used silver baking, indium soldering, molybdenum-manganese and resin (flux) bonding methods.

Glass, Ceramic, Aluminum and Stain-less Steel are commonly known as non-solderable materials with conventional soldering systems. Heating is not enough to overcome this obstacle.

Ultrasonic vibrations in conjunction with heat cause the required effect and delivers the technical break through. This principle is based on the scientifically recognized 'Ultrasonic Cavitational Phenomenon' which is caused by strong ultrasonic penetration.

The Cerasolzer active-solder alloy together with an ultrasonic activated soldering system enables to solder on ‘hard-to-solder’ materials flux free

Description  Ø Wire Units  Melting Temperature

#CS186  1,6 mm  150 gr/1000 gr  186°C 
#CS224   1,6 mm  150 gr/1000 gr   224°C  
#CS246   1,6 mm  150 gr/1000 gr   246°C  
#CS297  1,6 mm  150 gr/1000 gr   297°C  
RoHS-conform (lead-free) 
#GS200ALU   1,6 mm  150 gr/1000 gr   200°C  
#GS155   1,0 mm  30 gr / 150 gr  155°C  
#GS182   1,0 mm   30 gr / 150 gr   182°C  
#GS217   1,0 mm   150 gr/1000 gr   217°C  
#GS220   1,0 mm   150 gr / 500 gr   220°C  

PDF  Technical Information

Additional background information: http://www.cerasolzer.com/cerasolzer/basic_info_gb.html