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Features
- Flux free |
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Cerasolzer is used in manufacture of electrical parts, to contact
electrical / electronically materials and flat glass / metalized
glasses because it provides a unique bonding technique that can take
the place of commonly used silver baking, indium soldering,
molybdenum-manganese and resin (flux) bonding methods.
Glass, Ceramic, Aluminum and Stain-less Steel are commonly known as
non-solderable materials with conventional soldering systems.
Heating is not enough to overcome this obstacle.
Ultrasonic vibrations in conjunction with heat cause the required
effect and delivers the technical break through. This principle is based on the scientifically recognized
'Ultrasonic Cavitational Phenomenon' which is caused by strong
ultrasonic penetration.
The Cerasolzer active-solder alloy together with an ultrasonic
activated soldering system enables to solder on ‘hard-to-solder’
materials flux free
| Description | Ø Wire | Units | Melting Temperature |
| #CS186 | 1,6 mm | 150 gr/1000 gr | 186°C |
| #CS224 | 1,6 mm | 150 gr/1000 gr | 224°C |
| #CS246 | 1,6 mm | 150 gr/1000 gr | 246°C |
| #CS297 | 1,6 mm | 150 gr/1000 gr | 297°C |
| RoHS-conform (lead-free) | |||
| #GS200ALU | 1,6 mm | 150 gr/1000 gr | 200°C |
| #GS155 | 1,0 mm | 30 gr / 150 gr | 155°C |
| #GS182 | 1,0 mm | 30 gr / 150 gr | 182°C |
| #GS217 | 1,0 mm | 150 gr/1000 gr | 217°C |
| #GS220 | 1,0 mm | 150 gr / 500 gr | 220°C |
PDF
Technical Information
Additional background information:
http://www.cerasolzer.com/cerasolzer/basic_info_gb.html